Y-Ba-Cu-O系Ag、Cu包套超导体的研制

研究了Y—Ba—Cu—O系超导体实用材料的制作工艺，找到了Y—Ba—Cu—0系超导体Ag、Cu包套带材及线材恢复超导的途径和工艺，成功地得到了有望实际应用的超导带材及线材。     

关于Cu(Ⅰ)、Cu(Ⅱ)化合物的稳定性问题

铜原子的特征电子构型3d~(10)4s~1,属ds区,Cu~ 电子构型3d~(10),Cu~(2 )电子构型3d~9。Cu的第一电离势7.7ev,第二电离势20.2ev。标准电极电位Cu~(2 )/Cu~ 0.17v,Cu~(2 )/Cu0.34v,Cu~ /Cu 0.52v。从特征电子构型来看,Cu(I)比     

三元金属间化合物La3Cu3Bi4的合成、结构与性能研究

The new intermetallic compound La3Cu3Bi4 was synthesized by arc melting method followed by annealing. The crystal structure refined using the Rietveld method and X-ray powder diffraction data showed to be Y3Au3Sb4 structure type with space group I-^43D （No.220）. The unit cell parameters were a = 0.997 797（7） nm and V = 0.993 41（2） nm^3. The structure was characterized by covalent Cu-Bi4 tetrahedron, which formed three-dimensional network by sharing corners and La atoms separated in the space of Cu-Bi4 tetragon. The expansion of La3Cu3Bi4 studied by using low temperature X-ray diffraction showed to be positive expansion and diminished with the temperature rising.     

三元金属间化合物La3Cu3Bi4的合成、结构与性能研究

The new intermetallic compound La3Cu3Bi4 was synthesized by arc melting method followed by annealing.The crystal structure refined using the Rietveld method and X-ray powder diffraction data showed to be Y3Au3Sb4 structure type with space group I43D(No.220).The unit cell parameters were a = 0.997 797(7) nm and V = 0.993 41(2) nm3.The structure was characterized by covalent Cu-Bi4 tetrahedron, which formed three-dimensional network by sharing corners and La atoms separated in the space of Cu-Bi4 tetragon.The expansion of La3Cu3Bi4 studied by using low temperature X-ray di?raction showed to be positive expansion and diminished with the temperature rising.     

二维超分子配位化合物[Cu（mal）（tpm）（H2O）]·2H2O的合成、结构及表征

合成了氢键连接的二维超分子配位化合物[Cu（mal）（tpm）（H2O）]·2H2O（mal=丙二酸,tpm=三吡唑甲烷）,并用元素分析和电子顺磁共振谱进行了表征。X射线单晶衍射表明该化合物的晶体属单斜晶系,Cc空间群,晶胞参数a=1．3624（2）nm,b=0．79318（14）nm,c=1．7526（3）nm,α=90°,β=102．352（3）°,γ=90°,V=1．8501（6）cm^3,Z=4。中心Cu（Ⅱ）离子为五配位,处于扭曲的四方锥配位环境中。晶格水与配位水形成较强的氢键将配合物连接成二维超分子结构。     

过渡金属桥联的具有3D结构的仲钨酸化合物:[Cu（H2O）2][Cu（H2O）3]2H3K[H2W12O42]·5H2O的合成、晶体结构和表征

首次以饱和Keggin结构阴离子[α-SiW12O40]4–前驱体为原料制备出了一例具有3D结构的仲钨酸化合物[Cu(H2O)2][Cu(H2O)3]2H3K[H2W12O42].5H2O(1),并用元素分析、IR光谱、UV光谱和X射线单晶衍射对化合物进行了表征和性质研究.在化合物1中,仲钨酸阴离子[H2W12O42]10–之间通过Cu2+离子的连接构成了漂亮的3D结构.