溅射功率对掺镁氧化锌薄膜结构及厚度的影响

采用射频磁控溅射法在玻璃衬底上制备掺镁氧化锌薄膜,利用SEM(扫描电镜)、XRD(X射线衍射)和椭偏仪等设备研究薄膜的表面形貌、成分、结构和厚度.结果表明,溅射功率没有对薄膜的生长方向产生较大影响,当溅射功率在40 W到100 W之间变化时,随着溅射功率的增大薄膜的结晶状况变好,晶粒尺寸变大,薄膜的厚度增加.     

反应磁控溅射Cu-Al-O薄膜的结构和光电学性质研究

反应磁控溅射方法在玻璃基片上沉积Cu-Al-O薄膜,并对薄膜进行退火处理,研究溅射功率和退火温度对薄膜结构和光电学性质的影响。用X射线衍射仪、分光光度计等仪器对薄膜的性质进行表征,采用拟合正入射透射谱数据计算薄膜的厚度。结果表明：不同溅射功率条件下制备的薄膜为非晶态,透射率在近红外部分达到60%以上,电阻率随溅射功率的增加呈U型变化,在120 W附近,电阻率达到极小值;退火后,薄膜的XRD谱出现Cu4O3、Cu O和Al2O3的混合相,薄膜透射率有所提高,电阻率随退火温度的提高而先增大后减小。     

掺碳氧化锌薄膜的铁磁性

采用磁控溅射方法在Al2O3（0001）和Si（100）衬底上制备掺碳氧化锌薄膜,溅射薄膜时衬底温度为550°C.实验结果显示,制备的掺碳氧化锌薄膜样品在Al2O3（0001）单晶衬底上结晶质量更好.在室温下,所制备的薄膜皆出现铁磁性,且在Si（100）衬底上制备的样品具有更大的饱和磁化值.实验结果表明氧空位缺陷对掺碳氧化锌薄膜的铁磁性起源有很重要的影响.     

用离子束增强沉积法制备In-N共掺杂ZnO薄膜

用In2O3粉体与ZnO粉体均匀混合,压制成溅射靶.在Si和SiO2/Si衬底上,用离子束增强沉积(IBED)方法对沉积膜作Ar+/N+注入,制备In-N共掺杂氧化锌薄膜.在氮气氛中作适当的退火,可以方便地获得取向单一、结构致密、性能良好的共掺杂ZnO薄膜.初步研究了INZO共掺杂薄膜的电阻率随退火条件的变化.     

直流磁控溅射制备纳米TiO_2薄膜研究

使用直流磁控溅射装置,通过在溅射过程中加入不同的金属网格,250℃条件下在玻璃衬底上制备了不同晶粒尺寸的TiO2薄膜.利用场发射扫描电子显微镜(SEM)、X射线衍射谱(XRD)对薄膜的表面形貌结构和进行了分析.研究结果表明:在磁控溅射过程中金属网格的引入能有效减小TiO2薄膜的晶粒尺寸,并且金属网格的网孔尺寸越小,晶粒尺寸越小.     

浅谈温度对台阶覆盖的影响

溅射工艺中衬底的温度参数是形成良好台阶覆盖的重要因素,本文通过实验对不同温度下铝膜的台阶覆盖情况进行实验研究,从而总结出铝膜溅射工艺中符合工艺要求的温度参数情况。     

高介电HfOxNy薄膜的表面形貌及光学特性研究

采用射频反应磁控溅射氧化铪钯的方法,在硅衬底成功制备了高介电HfOxNy薄膜．利用原子力显微镜,研究氮的掺入对薄膜表面形貌的影响,结果表明,N的掺杂改善了HfO2薄膜的表面形貌,同时抑制了高温退火过程中表面粗糙度的增加;通过椭圆偏振仪对薄膜的光学特性的研究表明,随退火温度的升高,薄膜的折射率和消光系数都呈上升趋势．     

氩氧比对射频反应磁控溅射制备TiO2薄膜亲水性能的影响

采用射频磁控溅射法制备了锐钛矿相TiO2薄膜,在基片温度、溅射功率、溅射时间以及靶材与基片间的距离等因素不变的情况下,研究不同氩氧分压比对薄膜亲水性能的影响。通过原子力显微镜(AFM)、X射线衍射光谱(XRD)表征了薄膜的微观表面形貌和晶相组成,采用静态接触角(SCA)评估薄膜的亲水性。实验结果表明不同氩氧比制备的锐钛矿相TiO2薄膜,紫外光照12 h后,接触角降到10o左右,而氩氧比小于等于5:5的接触角都低至5o左右,达到了超亲水性。氩氧分压比为4:6时,样品薄膜的光致亲水性最佳且光照后亲水性的保持较长。     

强紫外发射ZnO薄膜的溅射方法制备及表征

采用直流反应溅射方法在N型Si(100)衬底上制备了ZnO薄膜.薄膜的晶体结构采用X射线衍射技术来表征,测量结果表明制备的样品是沿c轴高度取向的六方纤锌矿结构的多晶薄膜.扫描电子显微镜测量显示薄膜的表面粗糙度较低,且ZnO与Si衬底的边界线清晰,结构致密.此外,利用室温光致发光谱研究了薄膜的光学性能,ZnO薄膜的室温光致发光谱(PL)只有位于377nm处的一个很强的紫外峰,这与材料内的激子复合有关.此外对薄膜进行了拉曼散射的研究,拉曼频移的计算结果表明溅射生长的薄膜中存在张应力(0.25Gpa).     

ZnO外延薄膜的制备及孪晶的形成

采用螺旋波等离子体辅助溅射沉积法在衬底Al2O3的(0001)面上沉积ZnO薄膜,所生长的薄膜在未退火和退火时表现出不同的平面内取向.未退火时薄膜表现出较好的单筹异质外延生长,而退火后薄膜的Φ扫描图像中出现了12个峰,这表明退火后薄膜出现反相筹,表现为孪晶生长.重点分析了退火对螺旋波等离子体辅助溅射技术外延ZnO薄膜的结构及表面形貌的影响规律,为外延ZnO薄膜质量的提高及该技术应用的探索奠定基础.     

Preparation of AIN thin films for film bulk acoustic resonator application by radio frequency sputtering

Aluminum nitride (AIN) thin films with high c-axis orientation have been prepared on a glass substrate with an A1bottom electrode by radio frequency (RF) reactive magnetron sputtering. Based on the analysis of Berg's hysteresis model, the improved sputtering system is realized without a hysteresis effect. A new control method for rapidly depositing highly c-axis oriented AIN thin films is proposed. The N2 concentration could be controlled by observing the changes in cathode voltage, to realize the optimum processing condition where the target could be fixed stably in the transition region, and both stoichiometric film composition and a high deposition rate could be obtained. Under a 500 W RF power of a target with a 6 cm diameter, a substrate temperature of 450 ℃, a target-substrate distance of 60 mm and a N2 concentration of 25%, AIN thin film with prefer-ential (002) orientation was deposited at 2.3 μm/h which is a much higher rate than previously achieved. Through X-ray diffraction (XRD) analysis, the full width at half maximum (FWHM) of AIN (002) was shown to be about 0.28°, which shows the good crystallinity and crystal orientation of AIN thin film. With other parameters held constant, any increase or decrease in N2 con-centration results in an increase in the FWHM of AIN.     

HfOxNy薄膜的制备及其性能研究

本文采用磁控溅射法制备了HfOxNy高介电薄膜，结合XRD、XPS等手段研究了退火温度对薄膜的结构和化学键态的影响，发现N的掺入使Hf4f峰位向低能方向移动．而随着退火温度的升高，Hf4f的双峰峰位向着高结合能的方向移动，这表明N的含量随着退火温度的升高而降低．XRD结果显示N的掺人能提高薄膜的晶化温度．     

Epitaxial α″-Fe_(16)N_2 Films Grown on NaCl (001) by Facing Target Sputtering

In 1972 ,KimandTakahashi[1] observedagiantsaturatedmagneticfluxdensity (Bs=2 .5 8T)whichwas 17%strongerthanthatofpureiron .BelievingthattheFe NfilmwasapolycrystallinemixtureofFeandα″ Fe16 N2 ,theydeducedthattheBsofα″ Fe16 N2 wouldbe2 .83Tfromthevolumeratioofα″ Fe16 N2 inthefilm .Sincethelargesaturatedfluxdensityisofimportance ,boththeoreticallyandfromthepointofviewofpracticalapplications,manyresearchershavemadegreateffortsandusedavarietyofmethodstosynthesizeα″ Fe16 N2 intobulkmat…     

Preparation of AlN thin films for film bulk acoustic resonator application by radio frequency sputtering

Aluminum nitride （AlN） thin films with high c-axis orientation have been prepared on a glass substrate with an Al bottom electrode by radio frequency （RF） reactive magnetron sputtering. Based on the analysis of Berg＇s hysteresis model, the improved sputtering system is realized without a hysteresis effect. A new control method for rapidly depositing highly c-axis oriented AlN thin films is proposed. The N2 concentration could be controlled by observing the changes in cathode voltage, to realize the optimum processing condition where the target could be fixed stably in the transition region, and both stoichiometric film composition and a high deposition rate could be obtained. Under a 500 W RF power of a target with a 6 cm diameter, a substrate temperature of 450 ℃, a target-substrate distance of 60 mm and a N2 concentration of 25%, AlN thin film with preferential （002） orientation was deposited at 2.3 μm/h which is a much higher rate than previously achieved. Through X-ray diffraction （XRD） analysis, the full width at half maximum （FWHM） of AlN （002） was shown to be about 0.28°, which shows the good crystallinity and crystal orientation of AlN thin film. With other parameters held constant, any increase or decrease in N2 concentration results in an increase in the FWHM of AlN.     

Thin film chip resistors with high resistance and low temperature coefficient of resistance

High resistance thin film chip resistors(0603 type) were studied,and the specifications are as follows:1 k? with tolerance about ±0.1% after laser trimming and temperature coefficient of resistance(TCR) less than ±15×10-6/℃.Cr-Si-Ta-Al films were prepared with Ar flow rate and sputtering power fixed at 20 standard-state cubic centimeter per minute(sccm) and 100 W,respectively.The experiment shows that the electrical properties of Cr-SiTa-Al deposition films can meet the specification requirements of 0603 type thin film chip resistors when the deposition time was about 11 min and deposition films were annealed at 500 ℃ for 120 min.The morphologies of Cr-Si-TaAl film surfaces were examined by scanning electron microscopy(SEM).The analysis suggests that Ta and Al may be distributed in CrSi2 film with mixed form of several structures(e.g.,bridge-like,capillary-like or island-like structures),and such a structure distribution is responsible for high film resistance and low TCR of Cr-Si-Ta-Al film.     

In－Situ Epitaxial Growth of Bi－Sr－Ca－Cu－O Superconducting Thin Films on Si（100） by rf Of－Axis Magnetron Sputering

Ｉｎ－ＳｉｔｕＥｐｉｔａｘｉａｌＧｒｏｗｔｈｏｆＢｉ－Ｓｒ－Ｃａ－Ｃｕ－ＯＳｕｐｅｒｃｏｎｄｕｃｔｉｎｇＴｈｉｎＦｉｌｍｓｏｎＳｉ（１００）ｂｙｒｆＯｆ－ＡｘｉｓＭａｇｎｅｔｒｏｎＳｐｕｔｅｒｉｎｇＱｉａｎＷｅｎｓｈｅｎｇ（钱文生）ＬｉｕＲｏｎｇ（刘...     

铝掺杂氧化锌薄膜的制备及其特性

采用直流反应磁控溅射法,制备了铝掺杂的氧化锌薄膜.结果显示：薄膜在500℃退火后透光率高,光敏特性良好,并且有明显的紫外光响应.其XRD衍射谱表明随着O2与Ar流量比的增加,对应于（002）晶面的衍射峰趋于尖锐,c轴取向突出明显.     

Ar/O_2比和基片温度对射频反应磁控溅射法制备钢基SiO_2薄膜亲水性的影响

在工作气压为1.9 Pa的氩氧气混合气氛中,改变氩氧的流量比和基片温度,采用射频反应磁控溅射法在不锈钢基片上制备了二氧化硅薄膜试样,并对薄膜的微观表面形貌和薄膜的亲水性进行表征.结果表明,在氩氧分压比为64和基片温度为90℃时制备的SiO2薄膜亲水性能最佳.