徽电子学专业若干教学问题的探讨

以培养21世纪高素质人才为目标，结合厦大物理系的基础和优势，在课程设置，教学内容与教学方法方面，对“微电子学”专业的若干教学问题作一些探讨。     

一种新型的模块式电子技术实验装置

介绍了一种新型的模块式电子技术实验装置。此模块化实验的电路形式能自由组合、便于操作并具有模块间的互换性、通用性及扩展性，使得实验资源的利用比传统的实验方式更趋于合理。本实验装置可适用于数字、模拟、数模混合电路以及在线可编程技术实验的需求。     

微电子学与固体电子学专家——刘玉岭教授

刘玉岭,教授,博士生导师,国家有突出贡献的中青年专家,河北工业大学微电子技术与材料研究所所长,微电子学与固体电子学学科带头人,河北工业大学电子科学与技术博士后流动站学术委员会主任,纳米电子技术与中国表面工程常务理事,全国高校科技先进工作者。河北省高层次拔尖人才,河北省优秀专家,河北省学位评审委员会专家、河北省十大发明家,天津市劳动模范,天津市先进科技工作者,第九、十、十一届全国政协委员。     

New Polymer Materials for Microelectronics Packaging

Researchers at the CAS Institute of Chemistry (ICCAS) have made breakthrough progress in developing the manufacturing technology of advanced polymer materials for microelectronics packaging applications. The advanced integrated circuit (IC) packaging polymer materials, including photoimageable polyimide resins and liquid epoxy underfills, are a key issue for FC-BGA/CSP(flip chip-ball grill array/chip scale packaging) which is the main stream for the next generation of microelectronics devices. With the down-sizing, thinning and high I/O (input/output) of IC chips, microelectronics packaging is now facing a big technology challenge.     

“EDA技术”课程实验教学的探索

结合申报"四川省精品课程"和"国家特色专业"的成功经验,从实验安排、实验内容、实验教材和实验平台等角度对该课程的实验教学进行了讨论,目的是使该课程开出特色、突出实用性,成为学生实实在在的"饭碗"课程。     

Science Letters： A robust polysilicon-assisted SCR in ESD protection application

A novel polysilicon-assisted silicon-controlled rectifier (SCR) is presented and analyzed in this paper, which is fabricated in HHNEC's 0.18 μm EEPROM process. The polysilicon-assisted SCRs take advantage of polysilicon layer to help bypass electro-static discharge (ESD) current without occupying extra layout area. TLP current-voltage (I-V) measurement results show that given the same layout areas, robustness performance of polysilicon-assisted SCRs can be improved to 3 times of con- ventional MLSCR's. Moreover, one-finger such polysilicon-assisted SCRs, which occupy only 947 μm2 layout area, can undergo 7-kV HBM ESD stress. Results further demonstrate that the S-type I-V characteristics of polysilicon-assisted SCRs are adjustable to different operating conditions by changing the device dimensions. Compared with traditional SCRs, this new SCR can bypass more ESD currents and consumes smaller IC area.