片式叠层陶瓷电容器（MLCC）中纯锡可焊镀层的研究

针对当前国内外无铅化趋势的要求,简单比较了多种锡系合金可焊镀层的优缺点,提出纯锡可焊镀层的研究方向,并开发出一种纯锡电镀的添加剂,最后从外观、可耐焊、润湿效果、加速氧化、端头拉力等方面,对Sn-Pb镀层和纯锡镀层进行了比较,发现纯锡镀层的各种性能均不弱于Sn-Pb镀层,部分性能还要优于Sn-Pb镀层.另外,本文对各种焊膏的性能也作了比较.

Study of Pure Tin Weldable Coating in MLCC

In view of the lead-free tendency at home and abroad,the advantages and disadvantages of various simple tin alloy weldable coating was compared, the research direction of pure tin solder plating additive was put forword, anda pure tin electroplatingadditive was developed. Finally from the appearance, resistance welding, wetting effect, accelerated oxidation, end force ere, the Sn-Pb coating and pure tin plating were compared.In addition, in this paper, the properties of various solder paste were compared.The result shows that various properties of pure tin plating is not weaker than that of Sn-Pb coating, some better than Sn-Pb coating.