| 硅基铜膜屈服强度的实验研究 |
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| 引用本文： | 王立.硅基铜膜屈服强度的实验研究[J].咸阳师范学院学报,2005,20(6):16-17. |
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| 作者姓名： | 王立 |
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| 作者单位： | 咸阳师范学院,物理学系,陕西,咸阳712000 |
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| 基金项目： | 咸阳师范学院科研基金资助项目(编号:02XSYK207) |
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| 摘 要： | 采用光学方法,测量了硅基镀铜膜的应力随厚度及温度变化关系。实验结果表明与弹性理论一致,屈服强度与膜厚的倒数近似成正比,且应力与温度相关。
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| 关 键 词： | 铜膜 屈服强度 应力 |
| 文章编号： | 1672-2914（2005）06-0016-02 |
| 收稿时间： | 2005-05-20 |
| 修稿时间： | 2005年5月20日 |
Stress as a Function of Temperature and Thickness in Copper Films on Silicon |
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| WANG li.Stress as a Function of Temperature and Thickness in Copper Films on Silicon[J].Journal of Xianyang Normal University,2005,20(6):16-17. |
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| Authors: | WANG li |
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| Abstract: | The stress variation with temperature and thickness in copper films deposited onto silicon wafers are studied.In good agreement with the elasticity,the yield strength of copper film is reciprocal to the film thickness.The variation of stress is dependent on temperature. |
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| Keywords: | copper films yield strength stress |
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