| IC芯片粘片机并联焊头机构的动刚度分析 |
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| 引用本文： | 彭卫东,陈新,李克天,敖银辉. IC芯片粘片机并联焊头机构的动刚度分析[J]. 天中学刊, 2005, 20(5): 10-12 |
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| 作者姓名： | 彭卫东 陈新 李克天 敖银辉 |
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| 作者单位： | 广东工业大学,广东,广州,510090 |
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| 基金项目： | 国家自然科学基金项目(50475044)，教育部科技研究重点项目(2004106)，高等学校博士学科点专项科研基金(20040562005)，广东省自然科学基金(04300155)，广州市科技攻关资助项目(2003Z2-D9021,2004Z3-D9021) |
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| 摘 要： | 针对所设计的IC芯片粘片机的并联焊头机构,建立了机构的振动方程和动刚度模型,使用Matlab软件得出了机构在整个工作空间的动刚度特性曲线,并对其分布进行了分析.根据这些曲线,说明所设计的并联焊头机构的动刚度能满足IC芯片粘片机的工作要求.
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| 关 键 词： | 并联焊头机构 动刚度 振动方程 特性曲线 |
| 文章编号： | 1006-5261(2005)05-0010-03 |
| 修稿时间： | 2005-05-20 |
Moving Stiffness Analysis on the Parallel Bonding Mechanism of IC Chip Die |
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| PENG Wei-dong,CHEN Xin,LI Ke-tian,AO Yin-hui. Moving Stiffness Analysis on the Parallel Bonding Mechanism of IC Chip Die[J]. Journal of Tianzhong, 2005, 20(5): 10-12 |
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| Authors: | PENG Wei-dong CHEN Xin LI Ke-tian AO Yin-hui |
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| Abstract: | The vibrating equation and the moving stiffness model are created for the Parallel Bonding Mechanism of the designed IC Chip Die, and its moving stiffness characteristic curves in whole working space are obtained through Matlab software and are analysed in this paper. Based on these characteristic curves, it proves that the moving stiffness of the designed Parallel Bonding Mechanism meets the working requirements of IC Chip Die. |
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| Keywords: | parallel bonding mechanism moving stiffness vibrating equation characteristic curves |
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