| 无铅锡膏的评价与选择 |
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| 引用本文： | 施纪红.无铅锡膏的评价与选择[J].苏州市职业大学学报,2011,22(4):10-13. |
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| 作者姓名： | 施纪红 |
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| 作者单位： | 健雄职业技术学院电气工程学院,江苏太仓,215411 |
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| 摘 要： | 基于无铅锡膏基本参数的分析,介绍经典锡膏评估验证法、Indium公司的4步无铅焊膏评估法和实际测试评估法3种锡膏评价体系.通过对每种评估法的系统性和实际操作性的分析,总结出企业生产中最有效的锡膏选择法,并给出了一个实例.
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| 关 键 词： | 无铅锡膏 合金成分 评价体系 SAC105MN SAC305 |
Evaluation and Selection of Lead-free Solder Paste |
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| SHI Ji-hong.Evaluation and Selection of Lead-free Solder Paste[J].Journal of Suzhou Vocational University,2011,22(4):10-13. |
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| Authors: | SHI Ji-hong |
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| Institution: | SHI Ji-hong (Electrical Engineering Institute,Chien-Shiung Institute of Technology,Taicang 215411,China) |
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| Abstract: | Based on the analysis of parameters for lead-free solder paste,the paper introduces three methods of solder paste evaluation,namely standard method of solder paste evaluation and verification,Indium 4-Step lead-free solder paste evaluation techniques,and practical test and evaluation.By analyzing the systematicness and practice of each evaluation,the paper sums up the most effective method of selecting solder paste with an example in manufacturing process. |
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| Keywords: | lead-free solder paste composition of alloy evaluation method SAC105MN SAC305 |
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