| INTERFACIAL TENSIONS OF SOLID COPPER/LIQUID LEAD AND SOLID COPPER/LIQUID BISMUTH |
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| 引用本文： | 刘友鹏,陶为民,吴申庆. INTERFACIAL TENSIONS OF SOLID COPPER/LIQUID LEAD AND SOLID COPPER/LIQUID BISMUTH[J]. 东南大学学报, 1991, 0(1) |
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| 作者姓名： | 刘友鹏 陶为民 吴申庆 |
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| 作者单位： | Department of Material Science and Engineering，Department of Material Science and Engineering，Department of Material Science and Engineering |
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| 摘 要： | The solid-liquid interfacial tensions of Cu(solid)-Pb(liquid)andCu(solid)-Bi(liquid)binary systems have been determined by the dihedral angle method.The results show that at 850℃ the interfacial tensions are 368±55mN/m for Cu-Pb sys-tem and 336±35mN/m for Cu-Bi systa,respectively,the error ranges of which aremore narrow than those found in some papers published abroad.In addition,there is nodetective segregation of other solute atoms or compounds in the vicinity of the tip of cop-per grain boundary where dihedral angles formed.
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INTERFACIAL TENSIONS OF SOLID COPPER/LIQUID LEAD AND SOLID COPPER/LIQUID BISMUTH |
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| Liu Youpeng Tao Weimin Wu Shenqing. INTERFACIAL TENSIONS OF SOLID COPPER/LIQUID LEAD AND SOLID COPPER/LIQUID BISMUTH[J]. Journal of Southeast University(English Edition), 1991, 0(1) |
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| Authors: | Liu Youpeng Tao Weimin Wu Shenqing |
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| Affiliation: | Department of Material Science and Engineering |
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| Abstract: | |
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| Keywords: | interfacial tension solids liquid copper lead bismuth/dihedral |
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