| 锡须的形成机理、危害及抑制措施 |
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| 引用本文： | 王文利.锡须的形成机理、危害及抑制措施[J].深圳信息职业技术学院学报,2009,7(4):60-63. |
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| 作者姓名： | 王文利 |
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| 作者单位： | 深圳信息职业技术学院信息技术研究所,广东,深圳,518000 |
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| 摘 要： | 本文对电子产品无铅化后纯锡镀层使用带来的锡须问题进行了研究，重点分析了锡须形成的机理，锡须对电子产品可靠性的危害，提出了抑制锡须的措施，对预防锡须的形成、提高电子产品的可靠性具有参考意义。
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| 关 键 词： | 锡须 机理 危害 抑制 |
Formation mechanism, hazard and suppress measures of tin whisker |
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| WANG Wenli.Formation mechanism, hazard and suppress measures of tin whisker[J].Journal of Shenzhen Institute of Information Technology,2009,7(4):60-63. |
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| Authors: | WANG Wenli |
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| Institution: | WANG Wenli (Department of Information Technology Research, Shenzhen Institute of Information Technology, Shenzhen, 518029) |
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| Abstract: | Tin whisker caused by pure tin plating from Focused on analyzing formation mechanism of tin whisker, lead-flee electronic products is studied in this paper the tin whisker hazard to electronic products reliability is discussed, some measures to suppress tin whisker is proposed . This paper is valuable to prevent tin whisker formation and improve the reliability of electronic products. |
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| Keywords: | tin whisker mechanism danger suppression |
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