| BGA封装IC的焊接 |
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| 引用本文： | 王小娟.BGA封装IC的焊接[J].宁波职业技术学院学报,2008,12(2):102-104. |
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| 作者姓名： | 王小娟 |
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| 作者单位： | 无锡商业职业技术学院,电子工程系,江苏,无锡,214153 |
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| 摘 要： | 详细介绍了维修BGA封装IC的整体思路以及修复IC的方法和要点,并对修复过程中可能出现的问题进行了探讨。
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| 关 键 词： | BGA封装 焊接 温度控制 风量控制 |
| 文章编号： | 1671-2153(2008)02-0102-03 |
| 修稿时间： | 2008年3月2日 |
Welding of IC based on BGA packaged |
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| WANG Xiao-juan.Welding of IC based on BGA packaged[J].Journal of Ningbo Polytechnic,2008,12(2):102-104. |
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| Authors: | WANG Xiao-juan |
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| Institution: | WANG Xiao-juan (Electronic Engineering Department,Wuxi Institure of Commerce,Wuxi 214153,China) |
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| Abstract: | This article introduced in detail services BGA to seal IC the overall mentality as well as repairs IC the method and the main point, and to repaired the question which in the process possibly appeared to carry on the discussion. |
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| Keywords: | BGA packaged welding temperature controlled air quantity controlled |
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