| 大功率LED散热技术探讨 |
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| 引用本文： | 刘菊. 大功率LED散热技术探讨[J]. 宜春师专学报, 2014, 0(6): 46-49 |
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| 作者姓名： | 刘菊 |
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| 作者单位： | 广东职业技术学院,广东佛山528041 |
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| 摘 要： | LED由于具有体积小、工作电压低、寿命长、节能等优点,必然在众多光源中占据优势地位,但散热问题是限制其发展的瓶颈;首先对大功率LED封装总的热阻进行了分析,确定了影响大功率LED封装散热的因素;然后对国内外LED最新散热技术的进展进行了比较.
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| 关 键 词： | LED封装 散热 热界面材料 基板材料 |
Advances in Heat Dissipation Technology for High-power LEDs |
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| LIU Ju. Advances in Heat Dissipation Technology for High-power LEDs[J]. , 2014, 0(6): 46-49 |
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| Authors: | LIU Ju |
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| Affiliation: | LIU Ju (Guangdong Vocational and Technical College, Foshan 528041, China) |
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| Abstract: | With many advantages, such as small volume, low voltage, long life, energy conservation, LED is dominant in many light sources. However, heat dissipation problem is the bottleneck for the LED development. To begin with, total thermal resistance of high - power LEDs is analyzed and some factors affecting the heat dissipation of high - power LEDs are confirmed. Moreover, latest advances for heat dissipation are introduced. |
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| Keywords: | LED Package Heat Dissipation Thermal Interface Materials Spreader Materials |
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