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Wafer-scale fabrication of high-aspect ratio nanochannels based on edge-lithography technique |
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| Authors: | Xie Quan Zhou Qing Xie Fei Sang Jianming Wang Wei Zhang Haixia Alice Wu Wengang Li Zhihong |
| Institution: | 1.National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing 100871, People’s Republic of China;2.Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, Michigan 48109, USA;3.School of Basic Medical Science, Peking University, Beijing, People’s Republic of China;4.Department of Biomedical Engineering, University of California at Davis, Davis, California 95616, USA |
| Abstract: | This paper introduced a wafer-scale fabrication approach for the preparation of nanochannels with high-aspect ratio (the ratio of the channel depth to its width). Edge lithography was used to pattern nanogaps in an aluminum film, which was functioned as deep reactive ion etching mask thereafter to form the nanochannel. Nanochannels with aspect ratio up to 172 and width down to 44 nm were successfully fabricated on a 4-inch Si wafer with width nonuniformity less than 13.6%. A microfluidic chip integrated with nanometer-sized filters was successfully fabricated by utilizing the present method for geometric-controllable nanoparticle packing. |
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