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Wafer-level SLID bonding for MEMS encapsulation |
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| Authors: | H. Xu T. Suni V. Vuorinen J. Li H. Heikkinen P. Monnoyer M. Paulasto-Krockel |
| Abstract: | （MEMS）bondingDefects Micro electronic mechanical systemSolid-liquid interdiffusion （SLID）Transient liquid-phase （TLP） bondingShear test Reliability |
| Keywords: | （MEMS）bondingDefects Micro electronic mechanical systemSolid-liquid interdiffusion （SLID）Transient liquid-phase （TLP） bondingShear test Reliability |
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