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面向制造的板级电子电路产品多信息模型研究
引用本文:李春泉,周德俭,俞涛. 面向制造的板级电子电路产品多信息模型研究[J]. 上海大学学报(英文版), 2004, 8(Z1)
作者姓名:李春泉  周德俭  俞涛
摘    要:


Multi-Information Model for PCB-Based Electronics Product Manufacturing
Abstract:Most electronics products use PCB to carry electronic circuits. This paper classifies information contained in PCB-based electronic circuits into several models: geometry model, physics model, performance model and function model. Based on this classification, a multi-information model of product is established. A composite model of product is also created based on object-orientation and characteristics of the product. The model includes a 3D geometry model, a physics model with integrated information that can be divided into microscopic and macroscopic information, a generalized performance model and a function model that are from top to bottom. Finally, a multi-unit analysis is briefly discussed.
Keywords:surface mount technology  geometry model  physics model  performance model
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