面向制造的板级电子电路产品多信息模型研究 |
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引用本文: | 李春泉,周德俭,俞涛. 面向制造的板级电子电路产品多信息模型研究[J]. 上海大学学报(英文版), 2004, 8(Z1) |
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作者姓名: | 李春泉 周德俭 俞涛 |
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摘 要: |
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Multi-Information Model for PCB-Based Electronics Product Manufacturing |
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Abstract: | Most electronics products use PCB to carry electronic circuits. This paper classifies information contained in PCB-based electronic circuits into several models: geometry model, physics model, performance model and function model. Based on this classification, a multi-information model of product is established. A composite model of product is also created based on object-orientation and characteristics of the product. The model includes a 3D geometry model, a physics model with integrated information that can be divided into microscopic and macroscopic information, a generalized performance model and a function model that are from top to bottom. Finally, a multi-unit analysis is briefly discussed. |
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Keywords: | surface mount technology geometry model physics model performance model |
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