| 配合物在电镀中的应用 |
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| 引用本文： | 刘丹萍. 配合物在电镀中的应用[J]. 郧阳师范高等专科学校学报, 2001, 21(3): 71-72 |
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| 作者姓名： | 刘丹萍 |
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| 作者单位： | 郧阳师范高等专科学校,化学系,湖北,丹江口,442700 |
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| 摘 要： | 电镀作为一门有用的工业技术,影响电镀镀层性能的因素很多,加入配位剂有助于提高阴极极化,降低电极反应速度,提高镀层的质量.
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| 关 键 词： | 电镀 配合物 阴极极化 |
| 文章编号： | 1008-6072(2001)03-0071-02 |
| 修稿时间： | 2001-03-28 |
The Application of Coordination Compounds in Electroplating |
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| LIU Dan-ping. The Application of Coordination Compounds in Electroplating[J]. Journal of Yunyang Teachers College, 2001, 21(3): 71-72 |
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| Authors: | LIU Dan-ping |
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| Abstract: | Electroplating is an effective technique in chemical industry. A lot of factors can affect the property of the plate. Ligation can increase cathodic polarization, reduce the electrodes reaction rate and increase the quality of the plate. |
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| Keywords: | electroplating coordination cathodic polarization |
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