碱性化学镀Ni-Cu-P工艺研究 |
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引用本文: | 崔绍波. 碱性化学镀Ni-Cu-P工艺研究[J]. 辽宁科技学院学报, 2016, 18(3). DOI: 10.3969/j.issn.1008-3723.2016.03.002 |
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作者姓名: | 崔绍波 |
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作者单位: | 辽宁科技学院生物医药与化学工程学院,辽宁本溪,117004 |
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基金项目: | 辽宁科技学院大学生创新创业训练计划项目(201511430064) |
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摘 要: | 通过正交试验,以硫酸镍和硫酸铜为主盐、次磷酸钠为还原剂研究了铝片表面的化学镀Ni-Cu-P工艺,其最优工艺配方为:硫酸镍25 g/L,硫酸铜2.0 g/L,次亚磷酸钠24 g/L,柠檬酸钠45 g/L,硫脲2.5mg/L,NaF 0.15 g/L,OP-100.8 mg/L,pH值9,温度70℃,施镀时间40min。通过耐硝酸变色试验检测了沉积层的抗蚀性,并讨论了沉积层抗蚀性的影响因素。
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关 键 词: | Ni-Cu-P化学镀 碱性 抗蚀性 因素 |
Study on the technology of Alkaline Electroless Plating Ni-Cu-P |
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Abstract: | Taking nickel sulfat copper sulfat as main salt ,hypophosphite as the reduced agent , and by means of orthogonal experiment , the paper dtudies the technology of electroless plating Ni -Cu-P on the surface of aluminium plate .The optimal process formula is i-dentified as below:NiSO4 · 6H2 O 25g/L, CuSO4 · 5H2 O 2.0g/L,NaH2 PO2 · H2 O 24g/L, sodium citrate 45g/L, CN2 H4 S 2.5mg/L, NaF 0.15g/L, OP-10 0.8mg/L, ph value 9, temperature 70, and plating time 40min.The corrosion resistance pf deposited layer is checked by means of nitric acid resisting , and many effects on the deposits are investigated . |
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Keywords: | Electroless plating Ni -Cu-P Alkaline Ability of corrosion Resistance Factors |
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